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Product 10203001

HDIO

Field Programmable Analog Array

 
HDIO Module.png

Product Overview

GET Engineering HDIO Field Programmable Analog Array (FPAA) Module (PN2030) allows for maximum flexibility.  This module features Maxim Integrated’s FPAA MAX 11300, which offers up to 20 channels. A Xilinx® Artix FPGA controls the FPAA IC.

Based on Maxim Integrated Programmable Mixed Signal I/O (PIXI™),  each ports can be software configured to provide highly flexible hardware configuration for 12-bit mixed-signal applications.  Best suited for applications that demand a mixture of analog and digital functions, each port is individually configurable with up to four selectable voltage ranges within -10V to +10V.  ADC, DAC, logic-level shifting and switches can be programed between pins.  Designed for reliability in a rugged and harsh environments, the HDIO System uses screws to firmly attach the module to the conduction cooled HDIO carrier card and thermal bars to conduct heat from the HDIO modules to the HDIO carrier card.   The HDIO module can be conformally coated for increased reliability against humidity.

 GET Engineering  provides the user with the HDIO FPAA 2030 Module Application Interface (API), and GET console.  The GET console is a program that provides the user with a Graphic User Interface (GUI) that discoveries the module and the user can set the input/output voltage range and values allowing the engineer to quickly start using the HDIO  family of products.


 

Key Hardware Features

  • Military and  Industrial Grade

  • Up to 20, 12-Bit ADC Inputs Single-Ended, Differential, or Pseudo-Differential

  • Up to 20, 12-Bit DAC Outputs

  • Up to 20, General-Purpose Digital I/Os

  • Switches 

  • Built-In-Test

  • PCI Express version 2.1 compliant

Key Software Features

  • 20 Configurable Programmable Mixed-Signal Ports Maximize Design Flexibility Across Platforms

  • Each port is individually program configurable with up to four selectable voltage ranges within -10V to +10V.

  • Logic-Level Shifting Between Any Two Ports

  • Support Windows or Linux OS

  • API

  • GET Console

     


Product Specifications

Form Factor/Physical
Size: ~ 21 x 64 mm
Weight: 0.014 lbs

Electrical
DC Input:   20 Channels
12 Bit ADC
Single-Ended,
Differential, or
Pseudo-Differential
0 V to +2.5V, 0V to +10V, ±5V, or –10V to 0V

DAC Output: 20 Channels
12 Bit ADC
0V to +10V, ±5V, or –10V to 0V

GPI: 0 to +5 V
Programmable Threshold Range 0 to +2.5V

GPO: Programmable 0 to +10 V
Logic Level Shifting between any pins

Power: TBD

Built-In Test:
FPGA Temperature Monitoring
Max11300 Temperature Monitoring

Interface
PCI Express Version 2.1

Environmental
Operating Temperature   -40° to 85° C         
Storage Temperature       -55° to 125° C
Humidity        Design to Meet MIL STD 810G
Shock     Design to Meet MIL STD 810G
Vibration       Design to Meet MIL STD 810G

MTBF     TBD

Information on this data sheet is subject to change without notice. 

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